New software module from GOEPEL facilitates X-ray image evaluation
A component of the new x-ray inspection software XI-Pilot V 3.1 is a module that allows for easier evaluation of x-ray images. The feature, called topoVIEW, facilitates this interpretation by construing each single gray value of an x-ray image as a change in materials thickness and density. Thicker materials such as solder, which registers as dark gray values, are displayed on a higher position than thinner PCB materials, which register as light gray values. This method reportedly allows for faults such as lifted leads and shorts to be displayed for easy analysis.
To Learn More:
Contact:GOEPEL Electronics
Headquarters: Austin, Texas, United States
Product:topoVIEW
Key Features: Simplified X-ray image analysis
What GOEPEL says:
View a press release on GOEPEL’s topoVIEW.
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James Carroll
Former VSD Editor James Carroll joined the team 2013. Carroll covered machine vision and imaging from numerous angles, including application stories, industry news, market updates, and new products. In addition to writing and editing articles, Carroll managed the Innovators Awards program and webcasts.
