Stacked event-based image sensors provide efficient data acquisition

The IMX636 and IMX637 image sensors combine Sony’s CMOS image sensor technology and Prophesee’s event-based vision sensing technology. Featuring a 4.86 µm pixel, the sensors asynchronously detect pixel luminance changes and output data with pixel position and time information.

Each sensor employs Sony’s proprietary Cu-Cu connection manufacturing process which makes possible direct connections between the pixel chip and the logic chip that includes a signal processing circuit. Only the pixels that detect luminance changes output data, resulting in high-speed, low-latency, high-temporal resolution, and low power consumption.

The sensors are also equipped with event filtering functions developed by Prophesee that eliminate unnecessary event data, such as LED flickering, that do not indicate a change in an object’s position. The filters may also be used to control the event rate and adjust the volume of data.

The sensors will be available in October 2021.

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To Learn More:

Contact: Sony Semiconductor Solutions Corporation
Headquarters: Tokyo, Japan
Product: IMX636 and IMX637 stacked event-based image sensors
Key Features: 4.86 µm pixel, asynchronously detect pixel luminance changes and output data with pixel position and time information.

What Sony Semiconductor Solutions Corporation says:
View more information on the IMX636 and IMX637 stacked event-based image sensors.

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