Advanced technology for CMOS assembly solutions now available

FEBRUARY 23--As many products become digital, the demand for immediate imagery products has increased. The merging of computing and imagery, the dispersal of camera modules in mobile phones, and the increasingly frequent use in automotive applications have increased demand for CMOS image sensors. These sensors have enabled a host of new applications for consumer, industrial, and commercial environments. Due to the specific nature of CMOS devices, extra care and expertise are required in the packaging and assembly process.

Alphasem AG (Berg/TG, Switzerland; www.alphasem.com) offers the solution from CMOS image sensor attachment over lens-holder assembly to manufacturing the complete system, including mounting of companion digital-signal processors and passive devices. The SWISSLINE die bonder with CMOS packaging option can mount the image sensor either on a ceramic package or a high-density laminate. The vertical wafer-table concept and the heavy-smoker options ensure gentle, contamination-free die attachment without any scratches. Ionizers at pick and bond prevent electrostatic-discharge damage to the image sensors.

Alphasem's new FLEXLINE assembly platform solves the challenges of subsequent processes such as lens holder assembly, companion digital-signal processor attachment, or mounting of passive components to finalize the complete image sensor system. It provides the ability to change quickly and easily with today's flexible manufacturing environment. Whatever the job is, the system allows complete process implementation and tailored solutions for various applications.