Zygo releases 3D imaging and surface metrology tool

Sept. 3, 2013
Zygo’s Nexview 3D imaging and measurement system is designed for precise, quantitative, and interactive surface metrology suited to semiconductor analysis and other scientific research applications.
Zygo’s Nexview 3D imaging and measurement system is designed for precise, quantitative, and interactive surface metrology suited to semiconductor analysis. Measurement types include flatness, roughness, large steps and segments, thin films, and steep slopes, with features heights ranging from <1 nm up to 20,000 µm. It features ISO 25178 surface measurement parameters and a streamlined design with no manual controls. In addition, it comes with all new graphical workflow software and vibration tolerance technology. The Nexview is suited for both production and scientific research markets.

To Learn More:

Contact:
Zygo
Headquarters
: Middlefield, CT, USA
Product:
Nexview 3D imaging and measurement system
Key Features:
Profiling for multiple surface types, vibration tolerance technology, graphical workflow software, streamlined design, automated operation.

What Zygo says:
View more information on the Zygo Nexview.

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About the Author

James Carroll

Former VSD Editor James Carroll joined the team 2013.  Carroll covered machine vision and imaging from numerous angles, including application stories, industry news, market updates, and new products. In addition to writing and editing articles, Carroll managed the Innovators Awards program and webcasts.

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