Cameras and Accessories

FLIR Systems announces release of micro thermal imaging camera core

FLIR Systems, Inc. has announced the release of its FLIR Lepton, a thermal imaging camera core that is about the size and weight of a conventional CMOS cell phone camera module.
Jan. 16, 2014

FLIR Systems, Inc. has announced the release of its FLIR Lepton, a thermal imaging camera core that is about the size and weight of a conventional CMOS cell phone camera module. The microbolometer-based thermal imaging camera was launched at the 2014 Consumer Electronics Show and is designed for integration into third party products such as smartphones, tablets, diagnostic tools, automobiles, and OEM applications. Lepton utilizes wafer-level detector packaging, wafer-level micro-optics, and a custom integrated circuit that supports all camera functions on a single integrated low power chip.

To Learn More:

Contact:FLIR
Headquarters: Wilsonville, OR, USA
Product:
FLIR Lepton
Key Features:Same size, weight, and power consumption as CMOS cell phone camera, microbolometer-based, custom-integrated circuit.

What FLIR says:

View more information on the FLIR Lepton.

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About the Author

James Carroll

Former VSD Editor James Carroll joined the team 2013.  Carroll covered machine vision and imaging from numerous angles, including application stories, industry news, market updates, and new products. In addition to writing and editing articles, Carroll managed the Innovators Awards program and webcasts.

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