Heat sink socket line from Andon to be featured at SPIE Photonics West
At SPIE Photonics West 2017, Andon will feature its patented Heat Sink Socket line. Combining the benefits of a heat sink and a socket, this solution enables users of image sensors, optoelectronic sensors, and other devices used on PC boards to avoid 1) excessive device heat and noise; 2) device damage from exposure to high temperature solder, electrostatic discharge, and cleaning solutions; 3) solder joint cracking and associated intermittency due to differences in thermal expansion between device and PCB; 4) the labor and PC board damage associated with de-soldering a faulty device, and 5) holding up PCB assembly until the devices arrive. Samples available for viewing at Andon booth.
SPIE Photonics West 2017 booth number: 4341
To Learn More:
Contact:Andon Electronics Corporation
Headquarters: Lincoln, RI, USA
Product: patented Heat Sink Socket line
Key Features: Dissipates heat and reduces noise, insulated socket with aluminum heat sink body.
What Andon says:
View more information on the Heat Sink Sockets.
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James Carroll
Former VSD Editor James Carroll joined the team 2013. Carroll covered machine vision and imaging from numerous angles, including application stories, industry news, market updates, and new products. In addition to writing and editing articles, Carroll managed the Innovators Awards program and webcasts.