Multispectral TDI image sensor based on CCD-in-CMOS technology developed by imec
At SPIE Photonics West 2017, imecshowcased a prototype of a multispectraltime delay integration (TDI) image sensor called Argus that is based on CCD-in-CMOS technology. The prototype TDI sensors use a format with 4096 columns and 256 stages per CCD array (or band) and a version with seven bands is available, which enables users to add seven spectral filters. These prototypes integrate CMOS drivers and readout circuitry and achieve a line rate of up to 300kHz.
Additionally, to enhance the TDI imaging performance, the TDI CCD-in-CMOS technology was combined with multispectral or RGB color filters that can be processed at wafer level. Alternatively, filters on glass may be used. The sensors are available in various models, including full custom design, prototype TDI sensors, and evaluation cameras. With its high sensitivity and speed, the TDI sensors, according to imec, are suitable for use in applications that include remote sensing, life sciences, and machine vision.
To Learn More:
Contact:imec
Headquarters: Leuven, Belgium
Product: Argus multispectral TDI image sensor
Key Features: Embedded CCD-in-CMOS technology, 4096 columns and 256 stages per band, one or seven-band versions, line rate up to 300kHz.
What imec says:
View more information on the sensor.
View a press release on the sensor.
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James Carroll
Former VSD Editor James Carroll joined the team 2013. Carroll covered machine vision and imaging from numerous angles, including application stories, industry news, market updates, and new products. In addition to writing and editing articles, Carroll managed the Innovators Awards program and webcasts.