High-speed 3D cameras and industrial vision sensors among highlights from SICK at VISION

At VISION 2018 in Stuttgart, Germany; SICK will showcase several its latest machine vision solutions, including the new Ranger3 3D camera (pictured). These 3D cameras feature a 2560 x 832 CMOS image sensor from SICK with Rapid On-Chip Calculation (ROCC) technology and can acquire 3D profiles at 7 kHz full frame. Additionally, the GigE Vision and GenICam-compliant cameras can process up to 15.4 GPixels/s and capture 3D, reflectance, and scattered light measurement in one device.

Additional products that will be featured at VISION include SICK’s TriSpectorP1000 programmable 3D vision sensors, programmable 2D InspectorP vision sensor and AppSpace, and a combined exhibit showing three different systems for robotic guidance. Furthermore, SICK will have its Visionary-TDT 3D detection Time of Flight camera and its Lector621 image-based code reader.

VISION 2018 booth number: Hall 1, Booth 1A36

To Learn More:

Contact: SICK Inc.
Headquarters: Minneapolis, MN, USA
Product: Ranger3 3D camera (among others, listed above)
Key Features:2560 x 832 CMOS image sensor from SICK with Rapid On-Chip Calculation (ROCC) technology, 3D profiles at 7 kHz full frame, 15.4 GPixels/s processing speed.

What SICK says:
View more information on the Ranger3 cameras.

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