Embedded vision cameras from Vision Components to be highlighted at VISION 2018
At VISION 2018 in Stuttgart, Germany; Vision Components will highlight its latest embedded visioncameras, including its VCSBC Nano Z smart cameras. These board-level cameras are available in a range of models with CMOS image sensors from Teledyne e2v and Sony and are based on a Xilinx Zynq System on Chip (SoC) module—a dual core ARM Cortex-A9 module with 2 x 866 MHz and an integrated, freely-programmable FPGA also from Xilinx. Offered with the cameras is the VC LibQ software library, which— in addition to over 300 proprietary functions for all typical image-processing tasks— comprises more than 2000 operators from MVTec's HALCON machine vision software.
In addition, Vision Components will showcase its new 3D laser scanners with integrated electronics, the VCnano3D-Z-series, which enable embedded 3D image processing applications. These scanners feature the same Zynq module with ARM processor and FPGA as above and can reach scan rates of up to 2 kHz. These scanners also feature CMOS image sensors, a class-2-rated, high-intensity blue 450-nm laser, GigE interface, and working distances from about 60 mm to over 3 m.
VISION 2018 booth number: Hall 1, Booth F42
To Learn More:
Contact:Vision Components
Headquarters: Ettlingen, Germany
Product: the VCSBC Nano Z smart cameras.
Key Features: Board-level embedded cameras with CMOS image sensors from Teledyne e2v and Sony, Xilinx Zynq SoC—a dual core ARM Cortex-A9 module with 2 x 866 MHz, Xilinx FPGA.
What Vision Components says:
View more information on the cameras.
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James Carroll
Former VSD Editor James Carroll joined the team 2013. Carroll covered machine vision and imaging from numerous angles, including application stories, industry news, market updates, and new products. In addition to writing and editing articles, Carroll managed the Innovators Awards program and webcasts.