Toshiba Teli and TriEye Collaborate on SWIR Camera

Toshiba Teli and TriEye are working together to commercialize a CMOS-based HD SWIR camera for industrial-related processes and applications, the companies announced in a news release.

The camera incorporates mass-market shortwave infrared (SWIR) sensing technology from TriEye.

Although InGaAs-based SWIR sensing has been around for decades, it remained limited to industries like semiconductor fabrication, aerospace, and science due to the high costs and low production yield. TriEye says its technology enhances machine vision capabilities and assists in the detection of visible and invisible malfunctions, providing additional image information for material sensing and quality control. The technology also enables high-resolution image data and depth perception in all weather and lighting conditions, TriEye says.

The two companies say they intend to make the camera available to a wide range of industries globally.

In explaining the partnership, Shinichi Itokawa, chief technology officer at Toshiba Teli, said, "This joint effort will accelerate the development of next-generation superior imaging tech capabilities for industrial cameras that will translate into every aspect of our lives."

In the past, TriEye, which was founded in 2017, announced collaborations with Hitachi Astemo, Porsche, Continental Engineering, Trimble, and DENSO. TriEye also has announced capital funding led by M&G Investments and Varana Capital, Samsung Ventures, Deep Insight, Tawazun Group, Allied Group, and Discount Capital. Follow-on investors include Intel Capital, Porsche and Marius Nacht.