EP5LTE-100

May 2, 2023

One component epoxy for bonding and sealing featuring a low coefficient of thermal expansion and a curing temperature of 100°C

Related To: Master Bond

Key Features

Unlimited working life at room temperature
Electrically insulating
Good flow properties
NASA low outgassing

Master Bond EP5LTE-100 is a flowable, one part epoxy with a low coefficient of thermal expansion. The curing schedule is 100°C for 90-120 minutes. Optimum properties are obtained by post curing for 2-3 hours at 100-125°C. The working life is unlimited because the epoxy will not cure until it reaches the elevated temperature. It should be emphasized that this system is not premixed and frozen and simply requires refrigeration for storage. EP5LTE-100 has very low shrinkage upon curing along with high dimensional stability.

EP5LTE-100 bonds well to a wide variety of substrates including metals, glass, composites, ceramics and many plastics. It has a very good glass transition temperature of 120-125°C allowing it to be used in high temperature environments. The service temperature range is -60°C to +175°C. The coefficient of thermal expansion at 25°C is a remarkably low 8-12 x 10^-6 in/in/°C. EP5LTE-100 has good resistance to water, oils, and fuels. The color is white. It can be used in electronic, aerospace, optical and specialty OEM type applications, among others, where a non-conductive, low CTE product is desirable. Some recent applications are in fiber optic packaging, including mounting optics and other components, and bonding fibers into ferrules. In microelectronics, low CTE’s are used for bonding SMDs and chips as well as die attach. The main idea is that a low CTE epoxy will induce minimal stress upon bonded parts, especially during thermal cycling. This along with the high Tg of EP5LTE-100 is unusual and highly advantageous.