Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology, is pleased to announce its new Genie Nano-CXP series, a CoaXPress line of CMOS area scan cameras that redefine performance and feature the latest On-Semiconductor and E2V sensors.
These newest industry leading image CMOS sensors range from 16 to 67 megapixel resolution with added and proven CoaXPress 6.25 Gbps technology offering breakthrough speed, robust build quality for wide operating temperature, and an unmatched feature set at an incredible price. Perfectly complemented by the half-length Xtium-CXP frame grabber, they have been designed to work synergistically, minimizing CPU usage and improving processing times for host applications by enabling maximum sustained throughput and ready-to-use image data.
Offering 25 million pixels at 80 fps in a small form factor, these new Genie Nano-CXP cameras are engineered to deliver high-speed, dependable results for applications such as semiconductor wafer inspection, electronics manufacturing, solar panel inspection, and machine vision.
Key Features:
- First 4 models with 16 and 25M offered in both monochrome and NIR enhanced versions
- Industry’s smallest 25M CXP cameras
- Trigger-to-Image Reliability (T2IR) framework improves the reliability of your inspection system and protects from data loss
- GenICam, GenCP compliant
- Robust all-metal body with 3 year warranty
For more information about the Genie Nano-CXP models visit the website. For high quality images, please visit our online media kit.
