DV-1100, with Intel 13th/12th Gen processors, is a high-performance and cost-effective embedded edge computer. It offers built-in M.2 Key B, Key E, and Key M slots, providing flexible wireless (5G, Wi-Fi, GNSS) and storage options to meet diverse application needs. The compact DV-1100 is ideal for smart manufacturing, machine vision, and railway computing in confined spaces.

Teledyne DALSA’s wide selection of cameras include color models featuring trilinear, plus NIR, and SWIR technology to deliver high speed and performance for inspection of web and print, packaging, print quality, food and fruit, and more. Fully integrated solutions include Contact Image Sensors (CIS) with superior image quality for EV battery and PCB inspection.

Master Bond EP30HT-LO is a NASA low outgassing epoxy featuring high temperature resistance and exceptional dimensional stability. EP30HT-LO has a robust physical strength profile with tensile lap shear and compressive strength. It also has notable electrical insulation values making it ideal for smaller potting and encapsulation applications.

On May 16, MVTec Software GmbH will release the new version 24.05 of its HALCON standard machine vision software. With this release, MVTec has focused on improving HALCON’s ease-of-use and rule-based machine vision. The most significant innovation in HALCON 24.05 is the extended parameter estimation for Shape Matching.