Teledyne e2v’s Optimom™ 5D turnkey imaging module features a 2M image sensor with a 2.5 µm global shutter pixel, a compact board, standard connector, and a pre-assembled lens. It seamlessly integrates full-HD 2D vision with the generation of 3D depth data, enabling the delivery of 3D objects or human visualization based on the detected contrast.
Industrial quality, basic features and a favorable price - this is what the low-cost portfolio from IDS Imaging Development Systems stands for. It includes a wide range of cameras with many different sensors from 2 to 20 MP, various housing variants and multiple lens mount options. Discover now all technical details and the benefits for your machine vision applications!
Master Bond EP30LTE-LO is a two component adhesive featuring high dimensional stability and low CTE. Serviceable over the temperature range of 4K to +250°F [4K to +121°C], EP30LTE-LO cures at room temperature and even faster at elevated temperatures. This low outgassing system bonds well to various substrates and features a tensile strength of 6,000-7,000 psi.
On November 20, 2024, MVTec is launching version 24.11 of its standard machine vision software HALCON. Users can look forward to groundbreaking technologies and improvements, including a preview of the new IDE HDevelopEVO. The focus is on even better user experience and deep learning algorithms.