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Master Bond

Master Bond formulates high quality, innovative adhesive systems ideal for the assembly of LED devices. Our goal is to help engineers meet specific requirements for their bonding, sealing and coating applications.
154 Hobart St
Hackensack, NJ 07601
United States
201-343-8983
201-343-2132

More Info on Master Bond

Shared User Cyb53f45e75ab44c83a0d0706dea6ae996 Led 61d4a3e10aeea

Master Bond formulates high quality, innovative adhesive systems ideal for the assembly of LED devices. Our goal is to help engineers meet specific requirements for their bonding, sealing, coating and encapsulation applications.

Key Benefits of Master Bond Adhesives, Sealants and Coatings

Master Bond’s wide-ranging product line of epoxies, silicones, UV curable and LED curable systems are reliable, come in convenient packaging and feature outstanding performance properties.  Each compound is designed to meet specific application needs and requirements, and can be formulated for: 

  • High optical clarity
  • A variety of refractive values
  • Withstanding UV degradation
  • Hardness or softness
  • Thermal cycling reliability
  • High bond strength
  • Chemical resistance
  • Mechanical stress resistance
  • High/low temperatures
  • And more!

Compounds may be used as conformal coatings, die attach adhesives, optical grade encapsulants, lens bonding and sealing systems and thermal interface materials. Certain grades are formulated to comply with NASA low outgassingUL 94V-0 and UL 94V-1 specifications for potting and conformal coatings, and feature outstanding flame retardancy and superior dielectric characteristics. We also offer non-corrosive RTV silicones that provide high transparency, excellent toughness, and fast, tack free time for lens bonding and sealing. 

Thermal management plays an essential role in LED product design Master Bond one and two component epoxy adhesive systems are used for heat sink attachment and offer outstanding heat dissipation and low thermal resistance for high, medium, and low power LED’s.

Expert Technical Support for LED Assembly

Our experienced technical representatives provide individual support to help determine the best adhesive for your application.

Products

Courtesy of Master Bond
EP112LS

EP112LS

Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation
Ep21 Lvfl

EP21LVFL

Two component, low viscosity epoxy for bonding, sealing, coating, and potting featuring good flexibility
Ep40 Tc Med

EP40TCMed

Two component, thermally conductive, electrically insulative epoxy system for medical device applications
Supreme3 Dm 85

Supreme 3DM-85

One component, toughened epoxy system for bonding, sealing, and dam-and-fill encapsulation
Ep5 Lte 100

EP5LTE-100

One component epoxy for bonding and sealing featuring a low coefficient of thermal expansion and a curing temperature of 100°C
Ep17 Htda 2

EP17HTDA-2

One component die attach epoxy system with exceptionally high glass transition temperature
Led415 Dc90

LED415DC90

One component, flexibilized LED curable system
Ep41 S 5 Med

EP41S-5Med

Two component epoxy system featuring excellent resistance to sterilants, solvents and autoclaving
Supreme42 Ht 2 Nd Black

Supreme 42HT-2ND Black

Two component, non-flow epoxy system for bonding, sealing and coating
Ep5 Tc 80

EP5TC-80

One component thermally conductive, electrically insulating epoxy with a curing temperature of 80°C

Press Releases

Image provided by Master Bond
Toughened Epoxy

Toughened, Non-Drip Epoxy Features High Glass Transition Temperature

Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. Supreme...
Image provided by Master Bond
EP21LSCL-2Med

Low Viscosity, Optically Clear Epoxy Passes ISO 10993-5 Standard

Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies...
Image provided by Master Bond
EP3HT-LO

One Part, Fast Curing Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP3HT-LO is a single component, non-premixed & frozen, heat cured epoxy, with an unlimited working life at room temperature. This system passes ASTM E595 tests...
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Number of VHP Cycles

Master Bond’s Epoxy Compatibility with STERIS’s Vaporized Hydrogen Peroxide Sterilization Process

Master Bond and STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporized Hydrogen Peroxide (VHPTM) using V-PRO® s2 Low ...
Courtesy of Master Bond
Master Bond EP21ARHTND-2

Non-Drip Epoxy Features Acid Resistance

Non-Drip Epoxy Features Acid Resistance Master Bond EP21ARHTND-2 is a two part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The...
Courtesy of Master Bond
Master Bond Supreme 11AOHTLP

Thermally Conductive Structural Epoxy Meets NASA Low Outgassing Specifications

Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts since...
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uv15dc801med

One Component, Dual Cure Epoxy for Medical Applications

Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations ...
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mastersil323slo

Two Part, Silver Filled Silicone Adhesive Meets NASA Low Outgassing Specifications

Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product...
ep114

Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity...
uv15rcl

One Part Epoxy Changes from Red to Clear Under UV Light

Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light...

Videos

Red Adhesive Turns Clear Upon Exposure to UV Light

Red Adhesive Turns Clear Upon Exposure to UV Light

UV15RCL adhesive is a UV curable, optically clear compound that changes from red to clear once exposed to UV light. This distinctive feature gives users the confidence that penetration...
652827f062b5a.1434378942_bfc823969fbf5d925148f94f0bcc805f6bc971d7509b06068481426b02becafb_d_640

Medical Grade UV Curable Adhesive For TPU Bonding

While bonding TPU is known to be challenging, Master Bond has formulated adhesive system UV17Med which has been specifically formulated for TPU to TPU bonding. This compound passes...
Hqdefault 620c090412286

Abrasion Resistant Epoxy

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. Independent tests demonstrate that this epoxy’s abrasion resistance value is significantly...
Hqdefault 620c065062157

Product Spotlight: EP30-2LB

Formulated with unique optical properties, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. Beyond its optical...
Maxresdefault 620c0616058a0

How Do You Use Dual Curing UV Light + Heat Adhesives

Watch this video to learn about dual curing adhesives that use both UV light, as well as heat for curing. These adhesives are ideal for use where complete UV curing is either ...

Resources

Image Provided by Master Bond
EP30HT-LO

EP30HT-LO: Utilized by NASA to bond components in lunar exploration vehicles

Overview of EP30HT-LOMaster Bond EP30HT-LO is a moderate-viscosity, two-component, epoxy system that can be cured at room temperature, or at elevated temperatures for a faster...
Image Provided by Master Bond
UV11-3

UV11-3: Used to create a self-written waveguide for fiber-to-lithium niobate chip coupling to reduce coupling losses

Overview of UV11-3 Master Bond UV11-3 is a hard, super-abrasion-resistant coating system for various substrates. It can be cured readily by ultraviolet (UV) exposure at around...
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Master Bond UV10TKLO-2

UV10TKLO-2: Used to Adhere Mirrors in a Kirkpatrick-Baez Microscope to Image X-ray Emissions During Deuterium-Tritium Implosions

Overview Master Bond UV10TKLO-2 is a one-component UV-curable system for high-performance bonding, sealing, and encapsulation applications. It meets NASA’s specifications...
Mb Wp Thumbnail Light Cure Adhesives 200x260

Whitepaper: Advanced Light Cure Adhesives

Breakthroughs in adhesive technology enable light curing adhesives to cure under a visible light wavelength of 405 nanometers. Learn how these environmentally friendly adhesives...
Case Study Ep21 Tdc 2 Lo

Case Study: EP21TDC-2LO: Adhesive for optical components in laser and space applications

Military and space-borne platforms face some of the harshest conditions experienced by any application. An adhesive used in such conditions must maintain its structural integrity...
Mb Wp Thumbnail Optically Clear Adhesives 200x260 (1)

Clearly Superior: Epoxies for Optical Applications

As technology in the optics industry continues to advance and improve, careful consideration of the properties of epoxies must be evaluated. When determining the most effective...

Buyer’s Guide Listing Information

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Additional content from Master Bond

supreme11aohtmed

Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity

Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity...
ep42ht2fgblack

Food Grade Epoxy Features Enhanced Chemical Resistance

EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. The epoxy...
uv23fldc80tk

Flexible, Thixotropic, One Component Dual Cure Epoxy

Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed...
Master Sil711 Med

One Part RTV Silicone Passes Non-Cytotoxicity Standards

Master Bond MasterSil 711Med is a one component, medical grade silicone adhesive that resists temperatures up to 400°F.
Supreme17 Htnd 2

Toughened, One Component Epoxy Features High Glass Transition Temperature

Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications. It is a true one component system, not premixed and frozen, with an unlimited working...
Ep21 Lvfl

Electrically Insulative Two Component Epoxy Features High Elongation

Master Bond EP21LVFL combines good flexibility with a solid strength profile. It is curable at room temperature with a long working life of 120-160 minutes at 75°F for a 100 gram...
Ep40 Tc Med

Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications

Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically...
Supreme3 Dm 85

One Part, Toughened Epoxy for Dam-and-Fill Encapsulation

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill...
Ep5 Lte 100

Thixotropic Epoxy Features Low Coefficient of Thermal Expansion

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely...
Ep17 Htda 2

Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements

Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally...
Led415 Dc90

Dual Curable Adhesive Offers Rapid Fixturing with LED Light

Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure...
Ep41 S 5 Med

Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization

Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical ...
Supreme42 Ht 2 Nd Black

Electrically Insulative, Toughened Epoxy Meets NASA Low Outgassing Specifications

Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to...
Ep5 Tc 80

Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability

Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity...
Master Sil323 Ao Lo

MasterSil 323AO-LO

Two part thermally conductive, electrically insulating silicone for bonding and sealing
Master Sil323 Ao Lo

Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications

Master Bond MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically...
Ep4 Cl 80 Med

EP4CL-80Med

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C for medical applications
Ep4 Cl 80 Med

Ultra-Low Viscosity, Biocompatible Epoxy Offers Optical Clarity

Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ...
Ep40 Nd

EP40ND

Two component, room temperature curing epoxy with good toughness, paste consistency
Ep40 Nd

Toughened, Non-Drip Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio...
Ep17 Tf

EP17TF

One component, toughened epoxy system for bonding, sealing and coating
Ep17 Tf

Toughened One Part Epoxy Withstands Thermal Cycling

Master Bond EP17TF is a one part epoxy with a paste consistency, that can be readily dispensed evenly and uniformly. It has a moderately high glass transition temperature (Tg)...
Uv17 Med

UV17Med

UV system for high performance bonding, sealing and coating featuring superb adhesion to thermoplastic urethanes (TPUs)
Uv17 Med

Biocompatible UV Curable Adhesive Formulated for TPU Bonding

Master Bond UV17Med is a one part, no mix, UV curable system. It was specially formulated to provide excellent adhesion to many TPUs (thermoplastic polyurethanes), which are widely...
Master Sil 323

Flowable Silicone Offers Thermal Cycling and Shock Resistance

Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. This product has a convenient to use 1:1 mix ratio, and can ...
Led405 Fl3

LED405FL3 Product Information

One component, flexibilized LED curable system
Ep88 Fl

EP88FL Product Information

Two component, room temperature curing epoxy for bonding, coating, sealing and potting
Uv26

UV26 Product Information

One part, very low viscosity UV curable system featuring high temperature resistance
Ep30 Lp 2

EP30LP-2 Product Information

High performance two part epoxy for bonding, coating, sealing and encapsulation
Ep4 G 80 Med

Low Viscosity, Electrically Conductive Epoxy Meets ISO 10993-5 Cytotoxicity Standards

Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to ...
Ep35 Aolv 0

EP35AOLV

Two component, thermally conductive, electrically isolating epoxy system for bonding, sealing and potting
Ep35 Aolv 0

Thermally Conductive Epoxy Features Chemical and High Temperature Resistance

Master Bond EP35AOLV is a two part heat cured epoxy system, designed for bonding, sealing, coating and potting applications.
Ep21 Ac Dsc5959

EP21AC

Two component epoxy system for encapsulating and coating that passes UL746A high amp arc ignition at 3.0 mm thickness with a PLC of 0
Ep21 Ac Dsc5959

UL Certified Epoxy Encapsulant Resists Arcing Without Igniting

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
Ep4 S 80

EP4S-80

One component, silver filled epoxy with a curing temperature of 80°C
Ep4 S 80

Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements.
Ep40 Tc

EP40TC Product Information

Two component, thermally conductive, electrically insulative epoxy system for bonding and sealing
Ep40 Tc

Thermally Conductive, Electrically Non-Conductive, Low Outgassing Epoxy

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.